About
Aegis, Inc.

Aegis, Inc.

Formerly known as Olin Aegis, HCC Industries acquired Aegis in 2004. Aegis had, over the previous two decades, established a reputation as the leading designer and manufacturer of hermetic packages in the world. HCC Aegis, as we now call the business, has built a team of dedicated professionals whose expertise in the metal hermetic package industry is unrivaled. Combined with a world-class manufacturing facility, our engineering and manufacturing skills enable us to make industry standard glass-to-metal-seal packages (Flatpacks, Plug-ins, Platforms) thru to the most complex hermetically sealed microelectronic package assemblies, which include DC and RF interconnects, ceramic modules and thermal management materials.

In addition to the traditional materials of Kovar, Cold-Rolled Steel and Stainless Steel our capabilities include new materials such as Aluminum Silicon Carbide (AlSiC) bases and housings. Ceramic feed thru’s offer interconnect alternatives to glass. No longer concepts, packages in these materials are produced in high volumes today.

Aegis has also introduced a patented, high-performance, surface mount power package product line with the best heat dissipation properties available today. This SMD package is now a qualified standard JEDEC outline.

In July 2005 HCC acquired selected assets of Kilburn Isotronics, then based in Chartley, MA, and moved these assets into the Aegis facility. HCC Aegis Inc., continues to manufacture the range of microelectronic packaging products formerly manufactured by Kilburn Isotronics

Aegis serves the Defense, Aerospace, Energy, Industrial, Telecommunications and Medical industries today.

Our capabilities include:

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