Microelectronic Packages

Hermetically sealed packages for the microelectronics industry are hermetic containers which protect the critical microelectronics and components utilized within our industries HCC’s microelectronic packages seal and protect delicate circuitry and use sophisticated metals and engineered designs that quickly dissipate heat to allow the devices inside to operate optimally. For example, the Company supplies a primary defense contractor with microelectronic packages that house vital electronics.

We have over twenty years of experience, technical development and the manufacturing Microelectronic Packages, including an entire facility, HCC Aegis, dedicated, to the design and development of hermetic packages. In addition, HCC has two other facilities with similar capabilities. We’ve designed and manufactured thousands of different packages for many markets; we offer our customers the ability to utilize the package options best suited for their needs.

The product types within our Microelectronic product line include:

Download Hybrid microelectronic packages and TO Headers data sheet from Glasseal Products here

Download data on Machined Electro-optical and micro-electronic packages from Glasseal Products

Download HCC design guides here